| 摘要 |
PURPOSE:To decrease the resistance of the coil of a magnetic head so that magnetic paths are reduced and the performance of the magnetic head is improved by cooling the thin film magnetic head by using a thermoelectric cooling element. CONSTITUTION:An insulator 2a is formed by vapor deposition, etc., on a heat conductor 1a consisting of a film or sheet of a metal having large heat conductivity. A conductor 3a and p-type semiconductor 4 having prescribed shapes are formed on the insulator 2a and thereafter, the semiconductor 4 is formed to a prescribed pattern by reactive ion etching, etc. An n-type semiconductor 5 is further formed and is etched to a prescribed pattern, following which an insulator 6 is formed by vapor deposition, etc., and is flattened. A conductor 3b is then formed to a prescribed shape and further, an insulator 2b is formed; thereafter, a heat conductor 1b having large heat conductivity is superposed thereon to form the thermoelectric cooling element. The thin film magnetic head A and the circuit element 12 formed by repeating the thin film formation and patterning are mounted on this thermoelectric cooling element. Said element is connected to the head A by a conductor 11. |
