SOLDERABLE CONDUCTIVE COMPOSITIONS, THEIR USE AS COATINGS ON SUBSTRATES, AND COMPOSITIONS USEFUL IN FORMING THEM

摘要

This invention provides conductive compositions that are directly solderable and that can be bonded directly to substrates. The compositions are made of silver exclusively in the form of flake and a resin system, said resin system comprising phenolic resin, acrylic resin, polyurethane resin, vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardner. By making a mixture of such a complex vehicle system a composition is produced that displays outstanding solderability and adhesion. Also provided is a method of making these compositions.