| 摘要 |
PURPOSE:To obtain the title material good in heat shock resistance and heat resistance and excellent also in moldability, by mixing an epoxy resin containing a phenolic hydroxyl compound with a microparticulate polymer of a specified siloxane compound. CONSTITUTION:The title molding material is prepared by mixing an epoxy resin (A) having at least two epoxy groups in the molecule (e.g., phenol novolac epoxy resin) and an organic compound (B) having at least two phenolic hydroxyl groups in the molecule (e.g., novolac phenolic resin) as main resin component with a resin mixture obtained by using part or the whole of A or B or part or the whole of a mixture of A with B as a dispersing medium, dispersing a self-curing siloxane compound in the form of microparticles in this medium and curing it. This molding material is excellent in heat shock resistance, heat resistance and moldability and is suitable for sealing electronic components.
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