| 摘要 |
PURPOSE:To prevent disconnection of a wire checking deformation thereof due to swelling of an adhesive material, by fixing a chip section and a substrate and the substrate and a substrate fixing member with a silicone rubber adhesive material to form both adhesion parts on the same surface of the substrate at the same thickness. CONSTITUTION:A chip section 1 and a substrate 9 are fixed and the substrate 9 and a substrate fixing member 10 are fixed with a silicon adhesive material 11. On the other hand, the substrate fixing member 10 and a case 3 are fixed by an epoxy adhesive material 12. Then, a plurality of protrusions 9a of the same height are formed on the substrate 9 to keep the thickness of the silicon adhesive material 11 constant. Thus, when a solvent infiltrates to swell the silicon adhesive material 11, the substrate 9 is forced down to keep the chip section 1 from displacement. Thus, there is no deformation of a wire 4 to connect the chip section 1 and a lead 2 embedded into the case 3 thereby enabling prevention of disconnection of the wire 4.
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