| 摘要 |
<p>A socket (2) for a flatpack semiconductor package (300) includes an insulative housing (4) with a plurality of terminal receiving channels (12) which open onto an upper surface (8). The channels (12) are in communication with apertures (18, 20) which are profiled for receiving tail portions (104) of terminals (98) therethrough for interconnection of the tail portions (104) to a printed circuit board. The electrical terminals (98) are disposed within the channels (12) with a contact portion (122) situated above the upper face (8) for contact with the flatpack semiconductor package leads (304). The terminals (98) are designed with a lengthened beam section which forms the contact portion (122) which defines the force deflection characteristics of the terminals (98) to be somewhat insensitive to the insertion depth of the carrier (250). The housing (4) includes latches (150) on the ends of the housing (4) which are rotatable to accept the carrier (250) and which latch the carrier (250) and package (300) within the housing (4) with the leads (304) of the package (300) loaded against the contact portions (122) of the terminals (98) with predetermined contact force.</p> |
