| 摘要 |
<p>An infrared detection system is disclosed comprising a planar array segment of infrared detector elements (21), a multi-layer module (10) and a buffer board (15) disposed intermediate the detector array segment and the multi-layer module. The buffer board is disposed parallel to the planar array segment of detector elements and transverse to the plane of the module layers (11). The buffer board is disposed in abutting electrical connection with the detector elements and conductive patterns formed on the multi-layer module. The buffer board facilitates electrical communication between the detector elements and the module and conductive patterns formed on the module layers, and also enhances the structural characteristics and separate testability of the system components.</p> |
