发明名称 Device fabrication involving planarization.
摘要 <p>Planarization of geometrically difficult device surfaces is accomplished utilizing a coating technique relying on relatively low viscosity materials. In particular, device processing is accomplished by including a step that produces a planar surface by coating a nonplanar surface with a material that has a viscosity of less than 1000 cp and which upon curing into a solid material undergoes a volume change of less than twenty percent.</p>
申请公布号 EP0285245(A1) 申请公布日期 1988.10.05
申请号 EP19880301340 申请日期 1988.02.18
申请人 AMERICAN TELEPHONE AND TELEGRAPH COMPANY 发明人 CHANDROSS, EDWIN ARTHUR;HARTLESS, RAY LAWSON;YIU-CHO LAI, WARREN;LARSON, RONALD GARY;REUTLINGER, GEORGE WILLIAM;SCHUTZ, RONALD JOSEPH;STILLWAGON, LARRY EDWARD;TAYLOR, GARY NEWTON
分类号 H01L21/768;H01L21/302;H01L21/3065;H01L21/312;(IPC1-7):H01L21/312;H01L21/90 主分类号 H01L21/768
代理机构 代理人
主权项
地址