发明名称 ETCHING APPARATUS
摘要 PURPOSE:To obtain a uniform etching speed at the entire surface of a mask readily, by providing a mechanism, which moves the mask to be etched up and down, and providing a straightening mechanism, which is linked with the up-and-down movement of the mask to be etched and forcibly replaces etching liquid on the surface of the mask to be etched. CONSTITUTION:In a photomask etching apparatus, the following mechanisms are provided: a mechanism, which moves a mask 1 to be etched up and down; and a straightening mechanism 4, which is linked with the up-and-down movement of the mask 1 to be etched and forcibly replaces the etching liquid on the surface of the mask to be etched. For example, the mask 1 to be etched is put in the etching lIiquid in an etching bath 3 in the vertical attitude with a plate holder 2. Two parallel supporting rods 4 are supported with the plate holder 2 so that the rods can be moved up and down. A plurality of straightening plates 4 are linked in parallel between the rods so that the plates 4 can be moved. The straightening plates 4 receive liquid pressure based on the up and down moving directions of the plate holder 2 and are inclined in the right-down or right-up directions.
申请公布号 JPS63239954(A) 申请公布日期 1988.10.05
申请号 JP19870073078 申请日期 1987.03.27
申请人 NEC CORP 发明人 NAKAMURA SHINICHI
分类号 H01L21/306 主分类号 H01L21/306
代理机构 代理人
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