发明名称 LANCET FOR REMOVING SOLDER
摘要 PURPOSE:To improve the quality of a product by effectively and safely removing a solder bridge formed between the leads of electronic parts by forming a solid saw teeth-like part on one side of a rectangular thin plate-like lancet. CONSTITUTION:The solder removing part having saw teeth-like shape is formed at the lower side path of the lancet for removing solders in rectangular thin plate-like shape. A solid iron made material is used for the solder removing part 2. With the lancet 1 for removing composed like this, the solder bridge 13 formed between the leads 12 of an electronic part 11 can be removed effectively and safely.
申请公布号 JPS63238972(A) 申请公布日期 1988.10.05
申请号 JP19870073237 申请日期 1987.03.26
申请人 NEC CORP 发明人 YAMAUCHI FUSHIMI
分类号 B23K1/00 主分类号 B23K1/00
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