发明名称 PACKAGING DEVICE FOR ELECTRONIC PART
摘要 PURPOSE:To prevent abnormal motion of heating head by deciding as abnormality the state of the position of a heating head being located at the position apart from the specific soldering position on a board or the positioning device of an electronic part and stoping a moving means as well. CONSTITUTION:Abnormality decision is exerted based on the detection signals H, J outputted from the right side detector 36 and left end detector 37 of a 2nd air cylinder 27a and the detection signal G from the upper end detector 35 of a let air cylinder 26a. With detection of an abnormal signal switches 42a, 42b are made in OFF state and the air cylinder 27a in stop state. With the device of this composition, the productivity can be improved.
申请公布号 JPS63238973(A) 申请公布日期 1988.10.05
申请号 JP19860281085 申请日期 1986.11.26
申请人 TOSHIBA CORP 发明人 SUGA MIKIO
分类号 B23K3/00;B23K3/04;H05K3/34;H05K13/08 主分类号 B23K3/00
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