| 摘要 |
PURPOSE:To obtain a multilayered circuit board, in which three-dimensional circuits are formed, heat dissipating property is excellent and electric shielding effect is high, by laminating metal plates so that each layer has a patterned shape and at least one surface of facing plates has a recessed surface other than the connecting part of each layer, and filling an insulating material in a gap formed by the recessed surface. CONSTITUTION:A plurality of metal plates 21-23 are formed by the following way: the shape of the pattern corresponds to the conductive pattern of each layer; and at least one surface of the facing surfaces forms a recessed surface other than the electric connecting parts of the layer. The metal plates 21-23 are laminated in the order of the layers. A gap formed by the recessed surface of said metal plate and the facing surface is filled with an insulating material 28. For example, the metal plate is patterned in a specified shape. One surface of the facing surfaces of the circuit plate is formed in the recessed surface, with the electric connecting parts between the layers being made to remain. Thus, the bonding circuit plate 21, the inner circuit plate 22 and the lead circuit plate 23 are formed. The circuit plates 21-23 are laminated and assembled, so that they are electrically contacted one another at the parts other than the recessed surface. Then, the gap formed by the recessed surface of each circuit plate is filled with the low melting point glass 28. |
