摘要 |
PURPOSE:To perform the resistance welding dispensing with binding a wire around a lead of a stem by inserting a brushy or netlike conductive fine wire into a lower electrode. CONSTITUTION:The brushy fine wire 3A such as copper, etc., is inserted upward into the lower electrode 1 and fixed on a conductive supporting plate 2. As a result, since the lead of the stem mounted on the lower electrode 1 comes into contact with the brushy fine wire 3A, a semiconductor device is not destroyed by the electric surge. Further, even if the netlike fine wire 3B instead of the brushy fine wire 3A is inserted into the lower electrode 1, since the lead of the stem comes into contact with the netlike fine wire 3B at the time of welding, it acts as a ground and the semiconductor device is not destroyed.
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