| 摘要 |
PURPOSE:To mount semiconductor devices adequately even at curved surfaces and corner parts, by providing a package forming a columnar body, which has an approximately elliptical cross section and has tabs that are extended from the side surface to the lower end part at a specified pitch, and providing outer terminals, which are led out of both sides and bent along the outer surfaces between the tabs. CONSTITUTION:A package 16 forming a columnar body has an approximately elliptical cross section and has tabs 19, which are extended from the side surface to the lower end part at a specified pitch. Each outer terminal 20 is led out of both sides of the package 16, bent along the outer surface between said tabs 19 and extended to the lower end part. For example, planar parts 17 and 18 are formed on the upper end and the lower end of said package 16. Thus circuit wirings, which are provided on the inner surface of the main body of a machine can be bonded to corner parts. When the mounting part is curved, the outer terminals of the semiconductor devices can be bonded to a mounting pad in such a shape that the outer terminals conform to the curve. Therefore the solderable area can be increased, and packaging having the stable bonding strength can be performed. |
