| 摘要 |
PURPOSE:To prevent the deterioration of moisture resistance resulting from a contaminant on the outside, and to improve reliability by filling a section between a semiconductor chip and a substrate for loading with silicone gel and forming a member for obviating the flow of silicone gel onto the mounting surface of the substrate for loading in the peripheral section of the semiconductor chip. CONSTITUTION:A section between a semiconductor chip 1 and a substrate 3 for loading is filled with silicone gel 4 hermetically sealing external terminals for the semiconductor chip 1, bump electrodes 2 and the substrate 3 for loading. A member 5 for preventing a flow is shaped to the peripheral section of the semiconductor chip 1 on the mounting surface of the substrate 3 for loading. The member 5 for preventing the flow is formed by a thin-film such as a polyimide resin thin-film, and constituted so as to be made lower than the height of the rear of the semiconductor chip 1 loaded onto the substrate 3 for loading. Consequently, when the silicone gel 4 is cast, an outflow onto the mounting surface of the substrate 3 for loading of the silicone gel 4 is obviated, thus ensuring a fill of the silicone gel 4, then allowing hermetic seal. Accordingly, the moisture resistance of a semiconductor device can be improved, thus enhancing reliability. |
