| 摘要 |
An impact nailing and dimpling apparatus is described. In the apparatus there is provided a dimple forming member and a number of valve members for causing the dimple forming member to be repetitively hammered for providing a dimple in a wallboard or other surface and for setting a nail in the dimple. An adjustable nut is provided for shutting off the apparatus when the dimple and nail have been set to a predetermined depth. A nail feed mechanism automatically feeds nails from a cartridge to a position located beneath the dimple forming member. The baseplate is provided with recesses coupled to a source of vacuum for providing a negative pressure between the base and the wallboard or other surface against which the apparatus is held during nailing operations.
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