发明名称 ELECTRICALLY CONDUCTIVE RESIN COMPOSITION
摘要 PURPOSE:To obtain the titled composition capable of keeping electrical conductivity even at high temperature, having excellent age stability and moldability and suitable for electronic apparatuses, etc., by using electrically conductive fiber in combination with a low-melting metal as electrically conductive fillers and compounding the fillers with a flux and a phosphorus-based antioxidant. CONSTITUTION:The surface of an electrically conductive filler composed of (A) electrically conductive fiber having a diameter of 8-100mum (e.g. copper filament or brass filament) (5-80wt.% based on the whole composition), (B) a low-melting metal (e.g. soldering alloy composed mainly of Sn or Sn-Pb) (5-30wt.% based on the component A) and (C) a flux (e.g. stearic acid) 0.1-5wt.% based on the component (B) is coated with (D) a thermoplastic resin (e.g. polypropylene) containing 0.1-5wt.% phosphorous-based antioxidant to obtain integrated pellets, which are chopped to form the objective composition.
申请公布号 JPS63238163(A) 申请公布日期 1988.10.04
申请号 JP19870071570 申请日期 1987.03.27
申请人 TOSHIBA CHEM CORP 发明人 IWASE HIDEHIRO;HABATA KEIICHI
分类号 C08K7/02;B29C45/00;C08K7/00;C08K9/04;C08L101/00;H01B1/20;H05K9/00 主分类号 C08K7/02
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