| 摘要 |
PURPOSE:To uniformize characteristic to attain a high sensitivity, a small-sized and light-weight constitution, and a satisfactory resistance to environments by providing an insulating film between first and second electrodes so that this film is stuck to the surface of the second electrode. CONSTITUTION:The insulating film is provided between first and second electrodes so that it is stuck to the surface of the second electrode. That is, a thin insulating film is stuck to the surface of a lower electrode 6 by oxidation, CVD, sputtering, coating, or the like to shorten the distance between a metallic film 10 to be an upper electrode and the lower electrode 6 while keeping well insulation between them. Since this ultrasonic transducer is made by using a semiconductor substrate, the semiconductor substrate is holed with a high precision by the semiconductor fine etching and working technique to suppress the variance of device characteristic due to the production process, and an oscillating circuit and a reception circuit can be integrated with the semiconductor IC process technique. Thus, the ultrasonic transducer of high performance is produced with the small-sized and light-weight constitution.
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