| 摘要 |
<p>PURPOSE:To perform miniaturization and high integration in a contour size of an integrated circuit, by forming a circuit element on a through hole of a circuit substrate. CONSTITUTION:Conductors 2 are formed respectively on two sides of an insulating substrate 1 with a through hole 4, and further the conductor 2 is formed inside the through hole 4 too so that patterns on the front and the rear of the substrate 1 are connected to each other. After the through hole 4 is covered with an insulating glass 8 in succession, a conductor 9 is formed on the insulating glass 8 so as to form a resistor 3. Further, an adhesive 5 is used to stick a semiconductor pellet 6 on the conductor 9 on the insulating glass 8, and a lead wire 7 is used to connect the semiconductor pellet 6 with the conductor 2. Hence, a degree of freedom is increased for designing a thick film circuit on the periphery of the semiconductor pellet, and a small-sized hybrid integrated circuit of high integration can be obtained.</p> |
