| 摘要 |
PURPOSE:To prevent an uncoated part of resin from occurring on a semiconductor element by providing an uneven part for inducting the resin at the corner of the element surface. CONSTITUTION:An uneven part 15 formed at the corner of the surface of a semiconductor element 11 is reduced at its contacting angle with the surface of the element 11 of the dropped resin to be easily diffuse the resin to act to introduce it to the corner. That is, the resin dropped substantially at the center of the surface of the element 11 is spread in all directions to arrive at the recess 16 of the inner end of the part 15. The resin which arrives at the recess 16 of the inner end of the part 15 obtains its fluidity to be introduced to the corner of the surface of the element 11 to be guided to the part 15 to cover the whole surface. Thus, it can prevent an uncoated part of the resin from occurring on the surface of the element 11.
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