发明名称 BONDING WIRE
摘要 PURPOSE:To provide a bonding wire in which neck cutting by a heat cycle is prevented by forming the covered zone of high pure copper on the outer circumference of the core wire of a copper alloy incorporated with limited ratio of Zr. CONSTITUTION:The core wire zone 1 is formed from the copper alloy in which the recrystallization temp. is increased by incorporating 20-200wt.ppm Zn into high pure copper having >=99.99wt.% purity. The outer circumference of said core wire 1 is covered by the covered zone 2 of the high pure copper having >=99.99% purity to form the bonding wire 1. The concn. of the elements involved in the copper alloy of the core wire zone 1 is dissolved and diluted in the case of forming a ball by fusing the tips together at the time of bonding. The hardness of the ball is therefore regulated to the suitable value and chip cracks can be prevented. The thermocompression bonding and ultrasonic compression bonding with an outer lead can be easily executed as well since the soft high pure copper is used for the covered zone 2.
申请公布号 JPS63238235(A) 申请公布日期 1988.10.04
申请号 JP19870072613 申请日期 1987.03.26
申请人 FUJIKURA LTD 发明人 KUROSAKA AKITO;TOMINAGA HARUO;YASHIRO ZENJURO
分类号 C22C9/00;H01B1/02;H01L21/60;H01L23/48 主分类号 C22C9/00
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