| 摘要 |
<p>DEVICE FOR THE MOUNTING OF HYBRID CIRCUIT SUBSTRATES ON PRINTED CIRCUIT BOARDS The device comprises a mounting frame adapted to receive and support the hybrid circuit and a pair of wing frames, one at each end of the thin frame for supporting it at a predetermined angle in relation to the printed circuit board. The wing frames may be angled outwardly away from the mounting frame thereby allowing a plurality of the devices to be nestled adjacent one another in close proximity.</p> |
