| 摘要 |
<p>PURPOSE:To enable the safe takeout of a wafer from a magazine, by selecting a position of a sustaining member on the basis of data obtained in a device which recognizes a shape and a position of a contour of the wafer housed in the magazine and next lifting the wafer to form a gap between the wafer and a bottom plate. CONSTITUTION:A shape and a position of a contour of a wafer 55 are recognized by a wafer contour recognition device 58 connected with a camera 57, and the position of a center of gravity of the wafer 55 is computed by a center-of-gravity operational device 59 on the basis of data obtained from this recognition work. When a sustaining- member driving device 54 is driven on the basis of the data of this center of gravity G, the position of a sustaining member 61 is selected so as to involve the center of gravity G, and the sustaining member is projected upwardly from the upper surface 53 of the sustaining device 56 so as to lift the wafer 55 and to form a gap S between the surface and a bottom plate 82. Next the wafer 55 is supported on its lower side by the use of a supporting pawl 19 or the like and it is lifted so that it can be taken out from a magazine. Thus, the peripheral part and the upper surface of the wafer can be prevented from being broken and contaminated and so the high-reliability takeout of the wafer is enabled.</p> |
