| 摘要 |
<p>PURPOSE:To prevent thermal deformation of a mask substrate, by bonding a mask support frame to a securing ring by means of an adhesive which keeps its resiliency still after cured. CONSTITUTION:A recess 6 in a securing ring 4 is filled with adhesive 5. The reference surface of the securing ring, namely the surface on which the recess 5 is provided is contacted closely on the surface of the mask support frame 3 opposite to the one having mask patterns. A communication hole 7 provided in the securing ring 4 is aligned with a groove 9 provided on a base 9, and vacuum is drawn by means of a vacuum drawing duct 10 so that the mask support frame 3 is secured closely on the securing ring 4. A mask structure 12 thus prepared is heated to a temperature higher than a temperature used for exposure replication by several to several tens degrees so that the adhesive 5 is cured. In this manner, it is possible to prevent thermal deformation of the mask and to improve the precisions of gap and alignment between the mask and the wafer.</p> |
