| 摘要 |
PURPOSE:To execute a marking operation for simultaneous measurements of many chips by using one marker by a method wherein a defective integrated circuit judged to be defective by a testing system is positioned on a wafer, a stage or a head is shifted to a position where said head is aligned with said defective integrated circuit and the marking operation is executed. CONSTITUTION:A marker 7 is composed of a laser; a laser beam irradiates a wafer 6 from a head 10 via an optical fiber; a chip in an irradiated position is destroyed by the layer beam. A testing system 4 simultaneously measures more than one chip on the wafer 6. A test result from the test system 4 is stored in a memory device 2 via a controller 1. After a test has been completed, a shifting operation and a positioning operation of a chuck top 5 which is a stage to mount a wafer 6 for a probing system 3 are controlled by the controller 1; a defective chip inside the wafer 6 is aligned with an irradiating position of the head 10; this defective chip is destroyed by means of a marker 7.
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