发明名称 HERMETIC SEALING PACKAGE WITH CERAMIC COVER AND MANUFACTURE OF THE SAME
摘要 A sidebrazed ceramic package is provided with a closure seal that employs a high alumina ceramic lid that matches the composition of the package body. The lid is provided with a recess in the sealing face and the sealing face is provided with metallization that adheres to the ceramic and is wet by solder. The metallized ceramic lid is sealed to the metallization ring on the sidebrazed ceramic body by means of the conventional gold-tin solder. The resultant hermetic seal can be insepcted by observing the solder fillet in the lid recess. Such a closure seal is fully hermetic and can readily survive repeated thermal cycling.
申请公布号 JPS63237449(A) 申请公布日期 1988.10.03
申请号 JP19870237067 申请日期 1987.09.21
申请人 NATL SEMICONDUCTOR CORP <NS> 发明人 ROBAATO SHII BAIRUN;JIYON TEII IWANITSUKU;CHII-MEN YU
分类号 H01L23/02;B23K1/14;H01L21/50;H01L23/08;H01L23/10 主分类号 H01L23/02
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