| 摘要 |
PURPOSE:To prevent the segregation of a flux and to obtain a flux cored solder excellent in its charateristic by working below the m. p. temp. of a flux during the manufacturing stage contg. the compounding of a flux and solder. CONSTITUTION:A hole 2 is made at the center of a solder billet 1 and the solid resin(flux) 3 corresponding to this hole 2 is put into the hole 2 to form the composite billet for extrusion. The composite billet is then subjected to extruding in specific size at the temp. below the m. p. temp.(about 100 deg.C max.) of the resin. The extruded material is subjected to specific wire diameter or wire drawing at room temp. or below its temp. to form a resin cored solder. With this manufacturing method, the resin cored solder having no defect accompanied by the segregation of a flux(resin) is easily obtainable.
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