| 摘要 |
PURPOSE:To achieve a higher package density of an IC socket, by connecting resistors of different values to the same terminal of each IC output while other ends thereof are connected in common to monitor a common point thereof. CONSTITUTION:Each one end of resistors R11-R1N, R22-R2N and RN1-RNN different in a value is connected to the same terminal of IC sockets SK1-SKN corresponding to output terminals of ICs with respect to the IC sockets SK 1-SKN mounted on a burn-in board while the other end thereof is connected in common and level detecting sections DET1-DETN are provided to detect levels at common connection ends. Input terminals I1-IM of the IC sockets SK1-SKN are connected in common and a necessary waveform is applied through input terminals INP1-INPM of the burn-in board. Then, the ICs are mounted on the IC sockets SK1-SKN and when an input signal is applied to the input terminals INP1-INPN, output signals are obtained at output terminals O1-ON of the IC socket SK1-SKN corresponding to the output terminals of the ICs.
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