发明名称 COPPER ALLOY FOR LEAD MATERIAL OF SEMICONDUCTOR APPARATUS
摘要 PURPOSE:To obtain the titled alloy having good bendability, excellent strength, heat resistance and heat conductivity by specifying the compsn. consisting of Cr, Sn, P and Cu. CONSTITUTION:The titled alloy consists of, by weight, 0.03-0.2% Cr, 0.03-0.2% Sn, <=0.2% P and the balance Cu and has the improved strength and heat resistance without lowering the heat conductivity and bendability of Cu. The desired strength and heat resistance of the alloy are not obtd. at the time of below the lower limit and furthermore the lowering of conductivity is remarkable at the time of beyond the upper limit in Cr and Sn among the elements to be added of the above-mentioned alloy. On the other hand, the strength and heat resistance of the alloy are improved by P, but the heat conductivity is remarkably lowered and the workability is impaired at the time of >0.2% P.
申请公布号 JPS63235443(A) 申请公布日期 1988.09.30
申请号 JP19880001534 申请日期 1988.01.07
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 YAMATO KOZO;AKASAKA KIICHI;SHINOZAKI SHIGEO;KUROYANAGI TAKU
分类号 C22C9/00 主分类号 C22C9/00
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