| 摘要 |
<p>PURPOSE:To reduce stress from a packaging resin to the upper surface of a semiconductor chip, by making the thickness of the packaging resin at the upper surface part of the semiconductor chip thin. CONSTITUTION:A semiconductor chip 3 and a lead frame 2 are wire-bonded and thereafter packaged with a packaging resin 1. At this time, a recess part 1a, which makes the thickness of the packaging resin at the upper surface part of the chip thin, is formed. Then stress from the resin 1 to a circuit on the surface of the chip 3 is alleviated.</p> |
