| 摘要 |
PURPOSE:To utilize a polishing plate effectively, to lengthen the lifetime of the polishing plate and to polish an inspection needle positively by the polishing plate by moving the polishing plate in the oblique direction to the inspection needle. CONSTITUTION:When inspection needles 3 are abutted onto bonding pads 2a on each chip 2 in a semiconductor wafer 1 and respective chip 2 is inspected while foreign matters adhering at the tips of the inspection needles 3 with the inspection are removed by abutting a polishing plate onto the tips of the inspection needles 3, the polishing plate is constituted as a part having a means moving the polishing plate in the oblique direction to dicing lines in each chip 2 in the wafer 1. Accordingly, the inspection needles 3 and the polishing plate are relatively moved aslant, and the inspection needles 3 can be abutted onto the virgin section of the polishing plate even when mutual movement is smaller than the size of each chip 2, thus lengthening the lifetime of the polishing plate.
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