发明名称 DRY ETCHING APPARATUS
摘要 PURPOSE:To eliminate the possibility of sucking dust in free air and dust attached on sealing members into a reacting chamber, by using a first evacuating device for reducing pressure in the reacting chamber, and using a second evacuating device for reducing pressure in a side chamber in order to contact a door and the reacting chamber tightly. CONSTITUTION:A first evacuating device V1 is composed of an evacuating pipe 3, a vacuum pump P, which is connected to the pipe 3, and a valve 2 of the pipe 3. A second evacuating device V2 is composed of an evacuating pipe 10, a valve 11, which opens and closes the pipe 10, and a vacuum pump P1, which is connected to the pipe 10. Wafers 6a are put in a reacting chamber 1 together with a quartz jig 6, and a door 4 is closed. The valve 11 is opened, and evacuation is started through the pipe 10. The door 4 is sucked, and the door is tightly contacted with the reacting chamber 1 through sealing members 5 and 15. The valve 2 is opened, and the pressure in the reacting chamber 1 is reduced with the pump P. Thus dust is not sucked into the reacting chamber 1.
申请公布号 JPS63233532(A) 申请公布日期 1988.09.29
申请号 JP19870069417 申请日期 1987.03.23
申请人 MITSUBISHI ELECTRIC CORP 发明人 KIRIYAMA SHUJI;SONOBE YUKIO;HATASAKO KENICHI
分类号 H01L21/302;H01L21/3065 主分类号 H01L21/302
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