| 摘要 |
<p>PURPOSE:To transfer a plurality of wafers by one-time travel motion, and to improve the operating efficiency of a device by arranging pairs of grooves in each side plate in the plural in the vertical direction and shortening distances among the side plates without changing the positions the edge faces of the grooves and deepening the grooves at an upper step regarding the depth of these grooves. CONSTITUTION:A plurality of grooves 9a-9c are arranged to a pair of opposed side plates 9 holding wafers 1 in the vertical direction so as to maintain a plurality of the wafers 1 in the horizontal direction, and distances among the side plates 9 are shortened without altering the edge faces of the grooves 9a-9c and deepening the groove 9c at an upper step regarding the depth of these grooves 9a-9c. When a pair of the side plates 9 are opened by stages, the wafers 1 can be placed to predetermined positions in succession from the wafers 1 held at a lower step under the state in which a plurality of the wafers 1 are sustained. Accordingly, a plurality of the wafers can be transferred by one-time travel motion, and the wafers are set up to a wafer treater one by one, thus improving the operating efficiency of the wafer treater.</p> |
