| 摘要 |
PURPOSE:To prevent the effect of the dispersion of lead bending size, and to obtain stable distinct imprinting at all times by pushing up a semi-fabricated product, regulating the upper surface of the product in the height of imprinting and conducting imprinting. CONSTITUTION:In a device with an imprinting section 8 performing imprinting on the surface of a semiconductor device 3, leads of which are bent, a clamper 2 positioning the semiconductor device, a push-up pin 4 pushing up the semiconductor device 3 positioned at the clamper 2, and a stopper plate 1 regulating the height of the semiconductor device 3 thrusted up by the push up pin 4 at the position of the height of imprinting by the imprinting section 8 are mounted. Consequently, the semiconductor-device semi-fabricated product 3 and the clamper 2 are lifted simultaneously, the semi-fabricated product 3 is controlled at the position of the height of imprinting by the imprinting section 8 by the stopper plate 1, and the imprinting section 8 is lowered under the state and conducts imprinting. Accordingly, the displacement of the position of the height of the semi-fabricated product 3 due to the dispersion of lead bending size is compensated and the product 3 is regulated at the position of the height of imprinting at all times, thus positively performing imprinting all the surface of a resin section.
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