发明名称 FORMATION OF MASK ABSORBER FILM FOR X-RAY EXPOSURE
摘要 PURPOSE:To obtain an X-ray absorber pattern film having low internal stress by a Ti-W alloy film with excellent reproducibility by shaping the Ti-W alloy film through a sputtering film formation method using a reactive gas, in which nitrogen gas is added to argon gas, and mixing nitrogen into the Ti-W alloy film. CONSTITUTION:An X-ray absorber pattern film material employing a Ti-W alloy containing Ti is sputtered by a reactive gas, to which Ar gas and N2 gas are added, thus forming a film. The quantity of nitrogen gas mixed into argon gas is kept within a range of 30%-50% at that time. That is, when a Ti-W alloy film is shaped onto a mask substrate through a sputtering film formation method, N2 is mixed into the Ti-W alloy film by using the reactive gas in which N2 gas is added to Ar gas, thus forming an X-ray absorber pattern film by the Ti-W alloy film having an excellent absorption coefficient and low internal stress with superior reproducibility.
申请公布号 JPS63232425(A) 申请公布日期 1988.09.28
申请号 JP19870066254 申请日期 1987.03.20
申请人 MITSUBISHI ELECTRIC CORP 发明人 YOSHIOKA NOBUYUKI;FUJIWARA NOBUO;WATAKABE YAICHIRO
分类号 C23C14/14;C23C14/06;C23C14/34;G03F1/22;H01L21/027;H01L21/30 主分类号 C23C14/14
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