| 摘要 |
<p>PURPOSE:To manufacture a hybrid optoelectronic integrated circuit in a relatively simple step by so face-down bonding a semiconductor light emitting element as to cross over an optical guide to optically couple them. CONSTITUTION:A semi-insulating semiconductor substrate 1, an optical guide 3 formed on the substrate, an electronic element 2 formed on the substrate, and a semiconductor light emitting element 4 of flip chip type are provided, and the element is so face-down bonded to the substrate 1 as to cross over the guide 3 to optically couple the element 4 to the guide 3. Thus, an optoelectronic integrated circuit is obtained in a relatively simple manufacturing step, and reduced in size smaller than the structure of individual components to improve the reliability of the system.</p> |
