| 摘要 |
PURPOSE:To make the position of the joining of a clad material accurate while decreasing the number of processes by coining a wire bonding area for a lead frame while joining the clad material when the wire bonding area is coined. CONSTITUTION:A metallic foil on which aluminum, gold, etc., are applied is joined with the surface of a wire bonding area 26 at the nose section of an inner lead section for a lead frame 10 at the same time as coining when the wire bonding area is coined. A clad material 28 is shaped as a metallic foil in which a metallic layer 30 required for the wire bonding of aluminum, gold, etc., is applied onto a base material 32 such as an iron-nickel alloy, covar, etc., through evaporation, plating, etc., and the clad material is punched by a coining punch on coining for shaping the nose section of an inner lead section 16 to a flat surface while the punched clad material is lowered as it is left as it is held at the nose section of the coining punch through suction, etc., and contact-bonded and joined with the wire bonding area. Accordingly, cost can be inhibited at a low value. |
