| 摘要 |
PURPOSE:To prevent leads of lead mounting pad from displacing by using a mounting lead structure of a pitch corresponding to the irregularity of lead mounting pad pitch of a package. CONSTITUTION:Of leads for the external terminal of a dual-in-line or flat type package of many leads for a semiconductor, a lead structure in which the pitch 7 of lead mounts of a package 5 and a package connector pitch 8 are different is formed by etching or pressing before the leads are attached, and the leads are attached using it. Thus, since the lead structure in which the lead pitch corresponding to the irregularity of a pad pitch size for mounting the leads of the package is formed, the lead mounts are not displaced.
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