发明名称 DOWN FLOW LIQUID FILM TYPE EVAPORATOR
摘要 PURPOSE:To improve an efficiency of thermal conduction by a method wherein liquid coolant not evaporated at an outer surface of a thermal conducting pipe is evaporated again with in a thermal conducting pipe having a double pipes within an evaporator. CONSTITUTION:Liquid coolant flows down from a liquid coolant inlet port 2 to an outer side of a thermal conducting pipe 4, is heat exchanged with cold water 5 flowing from a water chamber 14 into the thermal conducting pipe 4, removes heat from the cold water 5 to cool the cold water. The water chamber 14 and a liquid distributing plate 15 are partitioned by water chamber partition plates 21. Slight clearances 16 are provided between the liquid distributing plate 15 and the thermal conducting pipe 4 and then coolant liquid flows down through the clearances. A part of a group of thermal conducting pipes constituted by the thermal conducting pipes 4 is a double pipe type thermal conducting pipe 17 having a double structure. Liquid coolant accumulated at a bottom part of an evaporator flows upwardly at the innermost part of the double pipe type thermal conducting pipe 17, exchanges heat with cold water flowing down the outer annular part 18, evaporates within the pipe and flows from the outlet port 8 into the compressor.
申请公布号 JPS63233290(A) 申请公布日期 1988.09.28
申请号 JP19870063835 申请日期 1987.03.20
申请人 HITACHI LTD 发明人 TAKAHASHI KENJI;OGURO TAKAHIRO;TORII TAKUJI;YAMASHITA TETSUHARU;ZUSHI SHIZUO
分类号 F28D3/00;F28D3/02 主分类号 F28D3/00
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