| 摘要 |
PURPOSE:To prevent the disconnection of a connecting lead and short-circuit of a wiring by forming an opening section for connection to an external substrate, an opening section for arranging a semiconductor element, a lead bridging the opening section for connection and a plurality of elongation compensating sections shaped to a lead section onto a film. CONSTITUTION:Sprocket holes 2 for forwarding a tape 1 in succession, device holes 4 housing semiconductor elements 3, and opening sections 5 for connection for outer-lead-bonding connection are bored to the tape 1 manufactured by an insulating film, and leads 6 and wirings 7 are shaped stuck fast to the tape 1. The leads 6 bridging the opening sections 5 for bonding connection each have two square-shaped spectacle-shaped elongation compensating sections 8 at that time, and the two elongation compensating sections 8 are shaped at both ends of the opening sections 5 for connection. The leads 6 are connected among the elongation compensating sections 8. Accordingly, the disconnection of the connecting leads and the short-circuit of the wirings are prevented.
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