| 摘要 |
PURPOSE:To prevent the peeling and internal cracks of the opening section of a molding resin by forming a resin film onto the rear of an island in a semiconductor device having the opening section of the molding resin on the rear of the island. CONSTITUTION:A semiconductor chip 1 is fixed onto the surface of an island 3 for a lead frame 2 with a solder material, electrode pads for the semiconductor chip 1 and leads 4 for the lead frame 2 are connected electrically by metallic wires 5, and a coating resin is applied onto the rear of the island 3 and thermally cured and a resin film 11 is shaped. The semiconductor chip is mounted to a sealing mold, a sealing resin is injected and cured, and a molding resin 7 having an opening section 6 is formed. Accordingly, the peeling of the molding resin and the generation of internal cracks can be prevented. |
