| 摘要 |
PURPOSE:To obtain the title composition which can cure in a thick film and excellent in soldering heat resistance, moisture resistance, adhesiveness, etc., by mixing a photocurable prepolymer with a photopolymerizable monomer, a photopolymerization initiator, a heat polymerization initiator and an epoxy group-containing silane coupling agent. CONSTITUTION:20-80wt.% total of 95-10wt.% photopolymerizable prepolymer (A) of an MW of 500-5,000 [e.g., di(meth)acrylate of bisphenol A/ethylene oxide adduct] and 5-90wt.% photopolymerizable compound (B) (e.g., styrene) is mixed with 0.1-10wt.% photopolymerization initiator (C) (e.g., benzil dimethyl ketal), 0.01-10wt.% heat polymerization initiator (D) (e.g. di-t-butyl peroxide), 0.0-10wt.% epoxy group-containing silane coupling agent (E) (e.g., gamma- glycidoxypropyltrimethoxysilane) and, optionally, 1-60wt.% inorganic filler (F) (e.g., CaCO3), 0.1-15wt.% coloring pigment (G) (e.g., TiO2). etc.
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