Low-temperature-crosslinking, flexible and/or elastic epoxy resin compositions and process for the preparation thereof

摘要

The invention relates to low-temperature-crosslinking, flexible or elastic epoxy resin compositions which contain a condensate of an epoxidised phenolic resin and/or of an epoxidised 2,2-bis[4-hydroxyphenyl]propane, mono- or diglycidyl ether or diglycidyl carboxylate, polyalkylene oxide diglycol, vegetable oils, epoxy resin, polyaminoamide and optionally mineral or organic fillers. The compositions are used, for example, for adhesive bonding or for sealing expansion joints.