| 摘要 |
The invention relates to a mother board (2) having a plurality of spring strips (6), which are arranged side-by-side in parallel on the side (4) facing the assemblies, and whose contacts (8) form a pin panel on the side (10) remote from the assemblies, and having at least one bus (26, 28), which consists of at least one bus line (30, 32). According to the invention, a contact pin (16, 18) is allocated to a bus contact pin (12, 14) of each spring strip (6) of a bus (26, 28), these contact pins (16, 18) are electrically conductively connected to one another by means of the bus line (30, 32), and each contact pin (16, 18) can be electrically conductively connected to its associated bus contact pin (12, 14) by means of a jumper link (20). This arrangement produces a mother board (2) having a bus (26, 28) overlapping the assemblies, it being possible to isolate assemblies from the bus (26, 28) without having to remove these assemblies from their plug-in positions on an assembly carrier. <IMAGE> |
