| 摘要 |
PURPOSE:To enable to easily coat ceramics with Al by a wet process by plating the ceramics with Ni or Cu by electroless plating and by carrying out Al electroplating in a molten salt bath contg. AlCl3 and butylpyridinium chloride. CONSTITUTION:Ceramics is plated with Ni or Cu by electroless plating and the plated ceramics is electroplated with Al in a molten salt plating bath contg. AlCl3 and butylpyridinium chloride or a plating bath prepd. by adding an org. solvent to the molten salt plating bath. The pref. concn. of AlCl3 in the plating bath is about 50-75mol.% and the pref. temp. of the plating bath is about 0-150 deg.C. The electroplating is preferably carried out with DC or pulsating current at about 0.1-30A/dm<2> current density. Thus, uniform Al plating can be carried out on the ceramics with satisfactory adhesion.
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