| 摘要 |
PURPOSE:To improve an S/N ratio by bonding a metal protrusion directly to a semiconductor substrate to compose a package for a semiconductor device. CONSTITUTION:A semiconductor substrate 1 having a photodetector 2 is bonded with an adhesive 6 to a ceramic package 9 in which a window is opened, and a pad 8 on the substrate 1 is connected by bonding wirings 7 to the package 9. A metal block 5 made in advance of copper and a metal protrusion 4 made of copper-indium are integrated, and the protrusion 4 is bonded to the photodetector 2. An incident light 100 is incident from a hole of the package 9 to arrive at the photodetector 2 through the substrate 1 to be converted into an electric signal. Since the block 5 cooled directly with refrigerant, such as liquid nitrogen or liquid helium is contacted through the protrusion 4 with the photodetector 2, cooling effect is high to obtain the high S/N ratio of the electric signal output from the photodetector 2. |
