发明名称 METHOD AND APPARATUS FOR SEALING
摘要 PURPOSE:To enhance the performances of non-airtight sealing package, by potting a sealing material, and performing defoaming of a sealing material layer before curing. CONSTITUTION:When potted resin layer 33 is sent to a facing position in a vacuum defoaming device 25, opened upper and lower chambers 26 and 27 are closed so as to hold a carrier tape 2. The insides of the chambers are closely sealed with sealing members 28 and 29. Then the insides of the chamber are evacuated so as to obtain a vacuum state through an exhausting port 30. At this time, bubbles 34 remaining in the resin layer 33 are sucked into the low pressure chambers and removed from the inside of the resin layer 33. After the defoaming is finished, the upper and lower chambers 26 and 27 are opened. The resin layer 33 is sent into a baking furnace 24 with the movement of the carrier tape 2. The resin layer 33 is heated and baked. The baked resin layer 33 is hardened and rigidly fixed to a group of inner leads 9 and a pellet 11 so as to form a unitary body. Thus a resin sealed package 35 is formed. In this way sealing performance such as moisture resistance, heat resistance and the like can be enhanced.
申请公布号 JPS63228630(A) 申请公布日期 1988.09.22
申请号 JP19870061042 申请日期 1987.03.18
申请人 HITACHI LTD 发明人 TAKEI EIJI;OHASHI YOSHIO;CHUMA TOSHIO
分类号 H01L21/56 主分类号 H01L21/56
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