| 摘要 |
PURPOSE:To shorten the processing time in a vacuum by providing a sample preparation chamber provided with a means to remove absorbed foreign objects on the surface of a sample at the front or rear of the processing chamber of a vacuum device and forcibly removing the surface foreign objects. CONSTITUTION:A sample, e.g., a semiconductor wafer 14, is mounted on a sample mount 7, and the wafer 14 is heated by a heater 6 to the preset temperature. At the same time, the valve 9a of an exhaust pipe 9 is opened, and the interior of a sample preparation chamber 3 is made a high vacuum state. After the heating process is thus performed in a vacuum for a preset time, the wafer 14 is moved to an analysis chamber 1 by a transfer device through an opening section 12a where a shutter 13 is released, then the microanalysis of the surface of the wafer 14 is performed. As a result, the microanalysis of the surface is performed in a short time, thus the time for the analysis performed by moving the sample from the preparation chamber 3 to the analysis chamber 1 can be sharply shortened. |
