| 摘要 |
PURPOSE:To reduce the cost and to enhance the density of a bump electrode by forming the electrode of one mask, and forming a metal film in the same size as that of the electrode. CONSTITUTION:A mask 5 used to form an opening in an insulating film 5 and a mask used to form an opening in a resist film 8 to become a mask for gold- plating are formed the same, and a mask for removing metal films 6, 7 is omitted. Further, an etchant is not invaded to a recess of the lower side of the bump, and the films 6, 7 are formed in the same size as that of the bump electrode 10. Thus, it can reduce its cost and to enhance its density.
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