| 摘要 |
PURPOSE:To shorten molding time by forming a component in first step of pouring molding resin under high pressure to fill a metal mold, second step of switching to low pressure immediately before resin pressure is abruptly increased in the mold, and third step of returning to the high pressure after the resin is poured in the mold. CONSTITUTION:The primary pressure of an external application pressure curve A is reduced to a secondary pressure curve D immediately before the internal pressure of an internal resin to pressure curve B is gradually increased with molding time for resin fill up at time C, i.e., slightly before the time C. Further, when a resin material is poured in a metal mold, it is raised to a tertiary pressure curve E. The molding time can be shortened by switching the pouring pressure between high pressure pouring and low pressure pouring to obtain a resin-sealed electronic component which does not undergo deformation and damage at an electric element and wirings.
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