| 摘要 |
<p>PURPOSE:To obtain an EPROM enhanced with equipping density of chips, and moreover at low cost by a method wherein the EPROM chips of the plural number of pieces are equipped to a package of one piece, and it is sealed using a quartz glass plate of one sheet and a sealing cover of one sheet. CONSTITUTION:A lead frame 3 enabled to be equipped with EPROM chips 1 of three pieces, for example, is fitted up to a package 2 of one piece, and the EPROM chips 1 of three pieces are equipped thereto according to die bonding. After the EPROM chips 1 thereof and the lead frame 3 are bonded using lead wires 4, a quartz glass plate 5 of one sheet having sufficient size to enter ultraviolet rays irradiated from the outside perpendicular direction, and a sealing cover 6 to seal airtightly the quartz glass plate 5 thereof and the package 2 are fitted up to the EPROM chips 1 thereof of three pieces. By forming the construction in such a way, in the assembling process of the EPROM device, because equipping work of the quartz glass plate 5 and the sealing cover 6 necessitating high precision can be completed at one time, the progress of work can be simplified, and moreover mounting density of the EPROM chips 1 on the package 2 can be enhanced.</p> |
